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datasheet product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays . 1/17 tsz02201-0f1f0c300020-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.07.25 rev.001 tsz22111 ? 14? 001 www.rohm.com ac/dc drivers ac/dc controller ic for non-dimmable led lighting bd550fhg general description led driver bd550fhg supports both isolated and non-isolated devices. ic enables simple design of low-power electrical converters. with switching mosfet and current detection resistor as external devices, it enables more freedom in design. since the peak current contro l is utilized, peak current is controlled in each cycle, application excels wide bandwidth and transient response. bd550fhg includes various protective functions such as soft start function, burst function, per-cycle over current limiter, vcc overvoltage protection and overload protection. an external latch pin (comp pin) is provided, so that latch stopping (off) can be set by external signals. this function is available as overheating protection and over output voltage protection. the pwm switching frequency is fixed at 65 khz. a frequency hopping function is included which contributes to low emi. features pwm frequency of 65khz pwm current mode method low circuit current when uvlo is on (12 a at vcc=12v) low circuit current without load (burst operation when load is light) built-in sw frequency hopping function 250nsec leading-edge blanking vcc uvlo / ovp per-cycle over current protection circuit soft start output overload protection (self-restart protection) external latch function for comp pin (over heating protection function) key specifications ? power supply voltage range: 8.5v to 25.0v ? operating current: normal: 0.60ma (typ) burst: 0.40ma (typ) ? oscillation frequency: 65khz (typ) ? operating temperature range: -40c to +110c package w(typ) x d (typ) x h (max) ssop6 2.90mm x 2.80mm x1.25mm a pplications ? electrical machineries for led lighting typical application circuit figure 1, application diagram (non-isolated type)
2/17 datasheet datasheet bd550fhg tsz02201-0f1f0c300020-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.07.25 rev.001 www.rohm.com tsz22111 ? 15? 001 pin configuration ssop6 (unit:mm) figure 2, external dimensions of ssop6 package pin description table 1 i/o pin functions no. pin name i/o function esd protection system vcc gnd 1 gnd i/o gnd pin - 2 fb i feedback signal input pin 3 comp i comparator input pin 4 cs i primary current sensor pin 5 vcc i power supply input pin - 6 out o external mos drive pin i/o equivalent circuit figure 3, i/o equivalent circuit 1 gnd 2 fb 3 comp 4 cs 5 vcc vcc vcc out 6out vcc cs gnd vcc r fb fb vcc comp r comp 5 0
3/17 datasheet datasheet bd550fhg tsz02201-0f1f0c300020-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.07.25 rev.001 www.rohm.com tsz22111 ? 15? 001 block diagram figure 4, block diagram
4/17 datasheet datasheet bd550fhg tsz02201-0f1f0c300020-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.07.25 rev.001 www.rohm.com tsz22111 ? 15? 001 description of each block ( 1 ) start sequences (soft start operation, light load operation, and overload protection) start sequences are shown in figure 5. this is al so shown the operation of overload protection. see the sections below for detailed descriptions vout switing vh vcc vcc=13.5v fb soft start 250ms iout normal load light load within 250ms vcc7.5v over load internal ref pull up burst mode ab cd efgh ij switching stop vcc7.0v figure 5, start sequence timing chart a: input voltage vh is applied b: vcc pin voltage rises by being supplied from vh line through start resistor ?rstart? and the ic starts operating when vcc > v uvlo1 (13.5v typ). switching operation starts when other pr otection functions are judged as normal. from startup to be stable output voltage, application s hould be set to stabilize output voltage during vcc > v uvlo2 (7.5v typ) because the vcc pin consumption cu rrent causes the vcc voltage drop. c: operated soft start function, maximum dut y is restricted to 15% during a 1ms period to prevent any excessive rise in voltage or current. from 1ms to 8ms, maximum duty is restrict ed to 25%. maximum duty is restricted to 75% after 8ms. d: vout voltage rises when the switching operation starts. once the output voltage starts, it is set to the rated voltage level within the t folp period (250ms typ). the output voltage is regulated within t folp (=250ms typ) from starting. e: during light load, when fb pin voltage < v bst (=0.3v typ), burst method is operat ed to keep power consumption down. f: over load condition occurs when fb pin voltage > v folp1a (=3.6v typ). g: when fb pin voltage is at v folp1a (= 3.6v typ) for more than t folp (250ms typ), the overload prot ection function is triggered and switching is stopped. the ic?s internal 250ms timer is reset during the t folp period (250ms typ) if fb < v folp1b even once. h: if the vcc voltage drops to v uvlo2 (7.5vtyp) or below, restart is executed. i: the ic?s circuit current is reduced and the vcc pin value rises. (same as b). j: same as d in figure 4, start resistor rstart is needed to start the application. when the start resistor rstart value is reduced, standby power is increased and the startup time is shortened. conversely, when the start resistor rstart value is increased, standby power is reduced and the startup time is lengthened. standby current is less than 20ua at vcc uvlo is disable, and it can calculate vcc uvlo voltage from v uvlo1 =14.5v (max). ex starting resistor rstart setting method; rstart = (vhmin - v uvlo1 max ) / i off max in the case of vac=100v (-20% of a margin), rsta rt requirement can be found by the following formulas: vhmin =100 2 0.8 = 113v because of v uvlo1 (max) =14.5v, rstart Q (113v - 14.5v) / 20 a 4.975m ? start-up time can be found by the following formulas: tstart = -rstart c vcc ln (1-v uvlo1 /vhmin) ex rstart=3.0m ? rstart resistor loss in this case is : pd (rstart) = (vh-vcc) 2 / rstart = (141v - 14.5v) 2 / 3.0m = 5.35mw. switching
5/17 datasheet datasheet bd550fhg tsz02201-0f1f0c300020-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.07.25 rev.001 www.rohm.com tsz22111 ? 15? 001 ( 2 ) vcc pin protection bd550fhg includes uvlo (under voltage locked out) and ov p (over voltage protection) functions to monitor vcc pin voltage (see figure 6 for ovp latch operation). the uvlo function prevents damage to mosfet by stopping sw itching operations by latch protection when the vcc pin voltage drops to vcc < v uvlo2 (= 7.5v typ). the vcc ovp function prevents damage to mosfet by stoppi ng switching operations when the vcc pin voltage exceeds v ovp1 (= 27.5v typ). the latch release condition is when vcc < v latch (v uvlo2 - 0.5v, typ = 7.0v). a latch blanking time is used for protecting mal-function. this time is 100us. 7. 5 v 13.5v vcc switing time off time 27.5v on 7. 0v off out on 100 us figure 6, vcc uvlo/ov p operation (latch)
6/17 datasheet datasheet bd550fhg tsz02201-0f1f0c300020-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.07.25 rev.001 www.rohm.com tsz22111 ? 15? 001 ( 3 ) dcdc driver (pwm comparator, frequency h opping, slope compensation, osc, burst) bd550fhg uses current mode pwm control. in the inte rnal generator, the average sw itching frequency is 65 khz. furthermore, switching frequency hopping function is built-in while the switching frequency fluctuation is shown as in figure 7. fluctuation cycle is 125hz (=8ms). figure 7, frequency hopping function the max-duty cycle is fix to 75% (typ) at out pin and minimum pulse width is fix at 500ns (typ). when the duty cycle exceeds 50% at current mode control, the sub-harmonic oscillation occurs. to prevent it, ic is built-in slope compensation function. bd550fhg has burst mode function to attain less power cons umption when load is light. th is function monitors fb pin voltage and detects light load when fb voltage < vbst (=0.3v typ). the secondary output voltage, the fb voltage and the dcdc function are shown in figure 8. fb pin is pulled up by r fb (=20k ? typ). at light load, when the secondary output voltage rises, the fb pin voltage will drop and when this goes below v bst (=0.3v typ) burst function will fo llow to reduce the power consumption. figure 8, switching operation status changes by fb pin voltage +4khz (+6%) -4khz (-6%) switching frequency 65khz burst 0.3v 2.8v fb pin voltage overload
7/17 datasheet datasheet bd550fhg tsz02201-0f1f0c300020-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.07.25 rev.001 www.rohm.com tsz22111 ? 15? 001 ( 4 ) over current limiter and leading edge blanking period bd550fhg has over current limiter for each switching cycle. when the cs pin voltage exceeds the v cs voltage (=0.5v typ), switching is turned off. in addition, when the driver mosfet is turned on, surge cu rrent occurs at each capacito r component and drive current. therefore, when the cs pin voltage rises te mporarily, the detection errors may occur in the over current limiter circuit. to prevent detection errors, the out pin is switched from low to high and the cs signal is blanked for 250nsec by the leb (leading edge blanking) function. this bl anking function enables a reduction of cs pin noise filtering in response to noise that occurs when the out pin is switched from low to high. ( 5 ) output overload protection function (fb olp comparator ) overload protection function monitors the load status of secondary output through fb pin and stops the switching of out pin during excessive load. in over load condition, there is no current in photo-coupler because output voltage decreases (drops) while fb pin voltage rises. when fb pin voltage exceeds v folp1a (=3.6v typ) at t folp (=250ms typ) interval continuously, a load is excessive and out pin is fixed to l. the timer of overload prot ection is reset when fb pin drops further than v folp1b (=3.4v typ) within tfolp (=250ms typ) after exceeding v folp1a (=3.6v typ). switching functions within this t folp (=250ms typ). fb voltage, which is pulled up in resistance to ic internal voltage operates from v folp1a (=3.6v typ) or more at start-up. for this matter, set the start-up time of the secondary output voltage such that the fb voltage is always v folp1b (=3.4v typ) or less within t folp (=250ms typ) at start-up. figure 9, overload protection (self-restart)
8/17 datasheet datasheet bd550fhg tsz02201-0f1f0c300020-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.07.25 rev.001 www.rohm.com tsz22111 ? 15? 001 0.0 ? 2.0 ? 4.0 ? 6.0 ? 8.0 ? 10.0 ? 12.0 ? 14.0 ? 16.0 ? 18.0 ? 20.0 ? 0 20 40 60 80 100 120 140 160 180 200 resister ? value r ? [k ] temparature t[ ] r t t(typ3.7k ) detect ( 6 ) comp pin external latch function ic is latched when the comp pin voltage goes below v latch (0.5v typ). a latch timer for t latch (100us typ) added to prevent operation errors caused by noise. the comp pin is pulled up by r latch (25.9k typ), and when r t (3.7k typ) is pulled down at the comp pin, latch protection is operated. some appl ication examples are shown in figure 10, figure 11, and figure 12. overheating protection by ntc thermistor a thermistor is attached to the comp pin so t hat latching can be stopped when overheating occurs. in the case of this application, it should be de signed so that the thermi stor resistance becomes r t (3.70k typ) when overheating is detected. (figure 10 and figure 11 are application circuit exampl es in which latch operation occurs when ta = 110 ) the variation in r t (=3.70k typ) shown in an electrical property includes only ic. please add the variation of external thermistor resistance to it and design. figure 10, comp pin overheating protection application figure 11, temperature-thermistor resistance value
9/17 datasheet datasheet bd550fhg tsz02201-0f1f0c300020-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.07.25 rev.001 www.rohm.com tsz22111 ? 15? 001 absolute maximum ratings ta=25 parameter symbol rating unit conditions maximum applied voltage 1 vmax1 30 v vcc, out maximum applied voltage 2 vmax2 6.5 v cs, fb, comp out pin output peak current i out 1.0 a allowable dissipation pd 674.9 (note1) mw when implemented operating temperature ra nge topr -40 to +110 o c storage temperature range tstr -55 to +150 o c (note1) ssop6: derate by 6.749 mw/c when operating abov e ta=25c (when mounted on 70 mm 70 mm, 1.6 mm thick, glass epoxy on single-layer substrate). recommended operating ratings ta=25 parameter symbol rating unit conditions power supply voltage range vcc 8.5 to 26.0 v vcc pin voltage electrical characteristics (unless otherwise noted, ta = 25 ? c, vcc=12v) parameter symbol specifications unit conditions min typ max circuit current circuit current (off) i off - 12 20 a vcc = 12v (uvlo = detection) circuit current (on) 1 i on1 - 600 1000 a fb = 2.0v comp: 100k ? (during pulse operation) circuit current (on) 2 i on2 - 400 600 a fb = 0.0v comp:100k ? (during pulse operation vcc pin protection function vcc uvlo voltage 1 v uvlo1 12.50 13.50 14.50 v vcc rise vcc uvlo voltage 2 v uvlo2 6.50 7.50 8.50 v vcc drop vcc uvlo hysteresis v uvlo3 - 6.00 - v v uvlo3= v uvlo1- v uvlo2 vcc ovp voltage 1 v ovp1 25.0 27.5 30.0 v vcc rise
10/17 datasheet datasheet bd550fhg tsz02201-0f1f0c300020-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.07.25 rev.001 www.rohm.com tsz22111 ? 15? 001 electrical characteristics of control bl ock (unless otherwise noted, ta = 25 ? c, vcc=12v) parameter symbol specifications unit conditions min typ max [pwm type dcdc driver block] oscillation frequency f sw1 60 65 70 khz fb=2.0v typ frequency frequency hopping width 1 f del1 - 4.0 - khz fb=2.0v hopping fluctuation frequency f ch 93 125 157 hz minimum pulse width t min - 500 - ns soft start time 1 t ss1 0.75 1.00 1.25 ms soft start time 2 t ss2 6.00 8.00 10.00 ms maximum duty 1 d max 68.0 75.0 82.0 % during normal operation maximum duty 2 d ss1 5.0 15.0 25.0 % during soft start 0[ms] to tss 1 [ms] maximum duty 3 d ss2 15.0 25.0 35.0 % during soft start t ss1 [ms] to t ss2 [ms] fb pin pull-up resistance r fb 15 20 25 k ? fb / cs rain gain - 5 - v/v fb burst voltage v bst 0.20 0.30 0.40 v during fb drop fb olp voltage 1a v folp1a 3.3 3.6 3.9 v when overload is detected (fb rise) fb olp voltage 1b v folp1b - v folp1a -0. 2 - v when overload is detected (fb drop) fb olp timer t folp 187 250 312 ms latch release voltage (vcc pin voltage) v latch - v uvlo2 -0. 5 - v latch release voltage vccuvlo2-0.5 [v] latch mask time t latch 50 100 200 us vccovp, comp mask time [overcurrent detection block] overcurrent detection voltage v cs 0.475 0.500 0.525 v leading edge blanking time t leb - 250 - ns [output driver block] out pin pch mos ron r pout 10 25 39 ? out pin nch mos ron r nout 3 7 12 ? [external latch comparator block] comp pin latch detection voltage v comp - 0.5 - v comp pin pull-up resistance r comp - 25.9 - k ? thermistor resistance detection value r t 3.30 3.70 4.10 k ? thermistor connected to comp pin
11/17 datasheet datasheet bd550fhg tsz02201-0f1f0c300020-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.07.25 rev.001 www.rohm.com tsz22111 ? 15? 001 typical performance curves (this is not a guarantee since this is the reference data. figure 36 shows the measurement circuit diagram.) 60.0 ? 62.0 ? 64.0 ? 66.0 ? 68.0 ? 70.0 ? -40 -25 -10 5 20 35 50 65 80 typ ? freq[ hz] temp[ ] 65.0 ? 67.0 ? 69.0 ? 71.0 ? 73.0 ? 75.0 ? 77.0 ? 79.0 ? 81.0 ? 83.0 ? 85.0 ? -40 -25 -10 5 20 35 50 65 80 maxduty1 (when ? typ ?? frequency)[%] temp[ ] 5.0 ? 7.0 ? 9.0 ? 11.0 ? 13.0 ? 15.0 ? 17.0 ? 19.0 ? 21.0 ? 23.0 ? 25.0 ? -40 -25 -10 5 20 35 50 65 80 maxduty2 (when ? typ ?? frequency)[%] temp[ ] figure 12, typ frequency fsw1 figure 13, maxduty1 (with typ frequency) figure 14, maxduty2 (with typ frequency 15.0 ? 17.0 ? 19.0 ? 21.0 ? 23.0 ? 25.0 ? 27.0 ? 29.0 ? 31.0 ? 33.0 ? 35.0 ? -40 -25 -10 5 20 35 50 65 80 maxduty3 (when ? typ ?? frequency) [%] temp[ ] 0.60 ? 0.70 ? 0.80 ? 0.90 ? 1.00 ? 1.10 ? 1.20 ? 1.30 ? 1.40 ? -40 -25 -10 5 20 35 50 65 80 maxduty ? ss1(vcc=15 [msec] temp[ ] 4.8 ? 5.3 ? 5.8 ? 6.3 ? 6.8 ? 7.3 ? 7.8 ? 8.3 ? 8.8 ? 9.3 ? 9.8 ? 10.3 ? 10.8 ? -40 -25 -10 5 20 35 50 65 80 maxduty ? ss2(vcc=15)[msec] temp[ ] figure 15, maxduty3 (with typ frequency figure 16, maxduty ss1 (vcc=15 figure 17, maxduty ss2 (vcc=15) 3.0 ? 4.0 ? 5.0 ? 6.0 ? 7.0 ? 8.0 ? 9.0 ? 10.0 ? 11.0 ? 12.0 ? -40 -25 -10 5 20 35 50 65 80 nmos ? ron(vcc=12)[ ] temp[ ] 10.0 ? 13.0 ? 16.0 ? 19.0 ? 22.0 ? 25.0 ? 28.0 ? 31.0 ? 34.0 ? 37.0 ? -40 -25 -10 5 20 35 50 65 80 pmos ? ron(vcc=12)[ ] temp[ ] 50.0 ? 75.0 ? 100.0 ? 125.0 ? 150.0 ? 175.0 ? 200.0 ? -40 -25 -10 5 20 35 50 65 80 timer ? latch[us] temp[ ] 0.0 ? 5.0 ? 10.0 ? 15.0 ? 20.0 ? -40 -25 -10 5 20 35 50 65 80 icc(vcc)off(vcc=12)[ua] temp[ ] 15.0 ? 17.0 ? 19.0 ? 21.0 ? 23.0 ? 25.0 ? -40 -25 -10 5 20 35 50 65 80 fbres(vcc=12)[k ] temp[ ] figure 18, nmos ron (vcc=12) figure 22, fbres (vcc=12) figure19, pmos ron (vcc=12) figure 20, timer latch figure 21, icc (vcc) off (vcc=12)
12/17 datasheet datasheet bd550fhg tsz02201-0f1f0c300020-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.07.25 rev.001 www.rohm.com tsz22111 ? 15? 001 150.0 ? 175.0 ? 200.0 ? 225.0 ? 250.0 ? 275.0 ? 300.0 ? 325.0 ? 350.0 ? -40 -25 -10 5 20 35 50 65 80 fb ? ovp ? 256ms(vcc=12)[ms] temp[ ] 0.48 ? 0.49 ? 0.50 ? 0.51 ? 0.52 ? 0.53 ? -40 -25 -10 5 20 35 50 65 80 curlim ? voltage(vcc=12)[v] temp[ ] 0.20 ? 0.25 ? 0.30 ? 0.35 ? 0.40 ? -40 -25 -10 5 20 35 50 65 80 fb ? burst ? voltage(vcc=12)[v] temp[ ] figure 23, fb ovp 256ms(vcc=12) figure 24, curlim voltage (vcc=12) figure 25, fb burst voltage (vcc=12) 0.37 ? 0.40 ? 0.43 ? 0.46 ? 0.49 ? 0.52 ? 0.55 ? 0.58 ? 0.61 ? -40 -25 -10 5 20 35 50 65 80 comp ? latch ? detect ? voltage[v] temp[ ] \ 5.00 ? \ 3.00 ? \ 1.00 ? 1.00 ? 3.00 ? 5.00 ? -40 -25 -10 5 20 35 50 65 80 comp ? latch ? detect ? voltage ? error[%] temp[ ] 19.4 ? 21.4 ? 23.4 ? 25.4 ? 27.4 ? 29.4 ? 31.4 ? -40 -25 -10 5 20 35 50 65 80 comp ? pull ? up ? res(vcc=12)[k ] temp[ ] figure 26, comp latch detect voltage figure 27, comp latch detect voltage error figure 28, comp pull-up res (vcc=12) \ 5.0 ? \ 3.0 ? \ 1.0 ? 1.0 ? 3.0 ? 5.0 ? -40 -25 -10 5 20 35 50 65 80 comp ? pull ? up ? res ? error(vcc=12)[%] temp[ ] figure 29, comp pull-up res error (vcc=12) figure 30, rcomp (vcc=12) figure 31, rcomp error 60.0 ? 62.0 ? 64.0 ? 66.0 ? 68.0 ? 70.0 ? 8.5 14.0 19.5 25.0 typ ? freq[khz] vcc[v] 0.480 ? 0.485 ? 0.490 ? 0.495 ? 0.500 ? 0.505 ? 0.510 ? 0.515 ? 0.520 ? 0.525 ? 0.530 ? 8.5 14.0 19.5 25.0 curlim ? voltage(vcc=12)[v] vcc[v] 3.32 ? 3.42 ? 3.52 ? 3.62 ? 3.72 ? 3.82 ? 3.92 ? 4.02 ? 8.5 14.0 19.5 25.0 rcomp(vcc=12)[k ] vcc[v] figure 32, typ frequency fsw1 (temp=25 ) figure 33, curlim voltage (temp=25 ) figure 34, rcomp (temp=25 )
13/17 datasheet datasheet bd550fhg tsz02201-0f1f0c300020-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.07.25 rev.001 www.rohm.com tsz22111 ? 15? 001 bd550fhg figure 35, measurement circuit diagram power dissipation the thermal design should set the operation for the following conditions. (since the temperature shown below is the guaranteed te mperature, be sure to take margin into account.) 1. the ambient temperature ta must be 110 or less. 2. the ic?s loss must be within the allowable dissipation pd. the thermal reduction characteristics are as follows. (pcb : 70mm70mm1.6mm mounted on glass epoxy substrate) 0 100 200 300 400 500 600 700 800 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 power disspation : pd [mw] temperature : ta [] figure 36, ssop6 thermal reduction characteristics gnd fb comp cs out vcc a a a
14/17 datasheet datasheet bd550fhg tsz02201-0f1f0c300020-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.07.25 rev.001 www.rohm.com tsz22111 ? 15? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all powe r supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epox y board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the ex pected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. rush current when power is first supplied to the ic, it is possi ble that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
15/17 datasheet datasheet bd550fhg tsz02201-0f1f0c300020-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.07.25 rev.001 www.rohm.com tsz22111 ? 15? 001 operational notes ? continued 11. unused input terminals input terminals of an ic are often connec ted to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electr ic field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic . the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure xx. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the c hange of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output curren t, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are autom atically restored to normal operation. note that the tsd circuit operates in a situation that exceed s the absolute maximum rati ngs and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other t han protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated overcu rrent protection circuit that is acti vated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit.
16/17 datasheet datasheet bd550fhg tsz02201-0f1f0c300020-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.07.25 rev.001 www.rohm.com tsz22111 ? 15? 001 physical dimension tape and reel information package name ssop6 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin
17/17 datasheet datasheet bd550fhg tsz02201-0f1f0c300020-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.07.25 rev.001 www.rohm.com tsz22111 ? 15? 001 ordering information b d 5 5 0 f h g - tr part number package g:ssop6 packaging and forming specification tr: embossed tape and reel marking diagram 5 0 part number marking 1pin mark lot number ssop6 (top view)
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bd550fhg package ssop6 unit quantity 3000 minimum package quantity 3000 packing type taping constitution materials list inquiry rohs yes bd550fhg - web page

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